File Name: ipc 1601 .zip
For complaints, use another form. Study lib. Upload document Create flashcards. Flashcards Collections. Documents Last activity. Add to Add to collection s Add to saved.
Users of this publication are encouraged to participate in the development of future revisions. However, many of these documents are obsolete, incomplete, do not address lead-free assembly processes, or do not cover newer laminates or final finishes. Additionally, the proliferation of alternative final finishes has produced concerns and requirements for printed board packaging and handling to preserve the finish and assure good solderability. These guidelines are intended to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge ESD when necessary , and moisture uptake. Moisture absorbed in printed board laminates expands at soldering temperatures, and in some cases, the resulting vapor pressure can cause internal delamination or excessive strain on plated-hole walls and other structures. This is especially challenging with the higher temperatures used for lead-free soldering. This document covers all phases from the manufacture of the bare printed board, through delivery, receiving, stocking, assembly, and soldering.
Secure PDF. Single User. $ Print. In Stock IPC, Revision A, June - Printed Board Handling and Storage Guidelines This document provides.
Superseded By: IPC Read more… Read less…. Prices subject to change without notice. About Us. Contact Us.
Updated: Nov 27, Ipc A f Pdf Free Keep workstation s free of static generating materials such as
Cart Check out. You must add 1 as a minimum quantity to buy this product. Notify me when available.